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Submit your article The addresses are listed on the inside front cover of the journal and on the Editorial Board Information. Vanka, Efficient computation of viscous internal flows, SBIR Phase-I Report, NAS3-25573, Propulsion Research Associates, Westmont, IL, August 1989. Engineering Applications of Computational Fluid Mechanics, International Communications in Heat and Mass Transfer, 2008 2nd Electronics System Integration Technology Conference. International Communications in Heat and Mass Transfer serves as a world forum for the rapid dissemination of new ideas, new measurement techniques, preliminary findings of ongoing investigations, discussions, and criticisms in the field of heat and mass transfer. 62-75. Search About Journals, Conferences, and Book Series, International Communications in Heat and Mass Transfer, Atomic and Molecular Physics, and Optics (Q1); Chemical Engineering (miscellaneous) (Q1); Condensed Matter Physics (Q1). 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Author contributions For transparency, we encourage authors to submit an author statement file outlining their individual contributions to the paper using the relevant CRediT roles: Conceptualization; Data curation; Formal analysis; Funding acquisition; Investigation; Methodology; Project administration; Resources; Software; Supervision; Validation; Visualization; Roles/Writing - original draft; Writing - review & editing. of propeller blades on fountain flow, Optimum tip gap and orientation of multi-piezofan for heat transfer enhancement of finned heat sink in microelectronic cooling, Visualization of Fluid/Structure Interaction in IC Encapsulation, An MpCCI-based Software Integration Environment for Hypersonic Fluid-Structure Problems, Numerical Modeling and Analysis of Microbump Pitch Effect in 3D IC Package with TSV during Molded Underfill (MUF), 3-D conjugate heat transfer analysis of PLCC packages mounted in-line on a Printed Circuit Board, Moisture.Sensitivity.of.Plastic.Packages.of.IC.Devices, Bioengineering Applications in heart surgery Artificial heart and Heart-Lung Machine: Design, Simulation and Fabrication, Three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using CFD software, FLUENT, The Effect of Gap between Plastic Leaded Chip Carrier (PLCC) Using Computational Fluid Dynamic (CFD) Software, FLUENT TM, The Comparison Between Thermal Pad Made of Nano-Silver and Silicon ElastomerUsing Computational Fluid Dynamic (CFD) Software, FLUENT, MULTIPHYSICS MODELLING FOR ELECTRONICS DESIGN, Thermal Assessment of Laminar Flow Liquid Cooling Blocks for LED Circuit Boards Used in Automotive Headlight Assemblies, Simulation and Modelling of Damage Mechanisms in Nuclear Graphite, Thermal optimization of 3D microcontacts using DOE and CFD analysis, Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package, Life Prediction and Damage Equivalency for Shock Survivability of Electronic Components, IJERT-Determination of Thermal Induced Stresses in Semiconductor Chip Package by using Finite Element Analysis: A Brief Review, Recent Developments in the Framework of Europe-China Collaboration on Green Electronics Production Research (EC-GEPRO), Wafer post-processing for a reconfigurable wafer-scale circuit board, Design Tools for Power Electronics: Trends and Innovations, Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading on Electronics Packaging, The Strategic Value of Multiphysics Simulation, FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process, Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application, Numerical Investigation of Convective Heat Transfer in Pin Fin Type Heat Sink used for Led Application by using CFD, Mechanical deformation behavior of SAC305 at high strain rates, Characterization and optimization of a thermal flow sensor on circuit board level, Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification, THERMAL ANALYSIS OF A HEAT SINK FOR ELECTRONICS COOLING, High strain-rate mechanical properties of SnAgCu leadfree alloys, A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints, Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process, The evolution of build-up package technology and its design challenges, JRA3 Electromagnetic Calorimeter Technical Design Report, Numerical Prediction of Heat Transfer Phenomena from a Chip Assembly for Low Reynolds Number, Numerical And Experimental Studies of Simple Geometries In Slamming, Bird Strike Simulation in Assuring Aircraft Safety, Creation of Computational Models of Cancellous Bone, Effect of cold work on microstructure and corrosion properties of 304L stainless steel, CFD MODELING ON CAPILLARY FLOW OF WAVE SOLDERING. see international communications in heat and mass transfer journal impact factor, sjr, snip, citescore, h-index metrics. 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